About Me
I am a final-year undergraduate student in Department of Electronic Engineering, Tsinghua University. My research interest is signal processing, computer vision, and wireless communication.
During the summer in 2023, I have had an internship working on computer vision under the supervision of Prof. Tianfan Xue in Multimedia Laboratory, the Chinese University of Hong Kong.
During Oct. 2021 ~ Jun. 2023, I was working on RIS-assisted communication systems in Broadband Wireless Communication and Signal Processing Laboratory, Tsinghua University, under the supervision of Prof. Linglong Dai.
📝 Publications
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Obj-NeRF: Extracting Object NeRFs from Multi-view Images
Zhiyi Li, Lihe Ding, Tianfan Xue
We propose Obj-NeRF, a novel comprehensive pipeline to extract object NeRFs from multi-view images, which can be used for NeRF editing tasks.
![sym](images/publications/ris_iwcmc.jpg)
RIS Energy Efficiency Optimization with Practical Power Models
Zhiyi Li, Jida Zhang, Jieao Zhu, Linglong Dai
IEEE International Wireless Communications and Mobile Computing Conference 2023 (IWCMC'23)
- Jida Zhang, Zhiyi Li, Zijian Zhang, Wideband Active RISs: Architecture, Modeling, and Beamforming Design, IEEE Communications Letters, vol. 27, pp. 1899-1903, Sep. 2023.
- Zhiyi Li, Jida Zhang, Jieao Zhu, Linglong Dai, Enhancing Energy Efficiency for Reconfigurable Intelligent Surfaces with Practical Power Models, arXiv preprint arXiv:2310.15901 (2023).
🎖 Honors and Awards
- 2023.11 Candidate of Tsinghua Grand Scholarship
- 2023.10 Chinese National Scholarship
- 2023.05 First Prize in 12th Science and Technology Challenge Cup in Beijing
- 2022.10 Jiang Nanxiang Scholarship (Top 2% in Tsinghua)
- 2021.12 First Prize in 13th Mathematics Competitions for Chinese College Students
- 2021.10 Chinese National Scholarship
- 2021.05 First Prize in 4th Artificial Intelligent Competition in Tsinghua University
- 2019.12 Gold Medal in 33rd Chinese Chemistry Olympiad and participant of the National Training Team (50 students nationwide annually)
📖 Educations
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B.E. in Electronic Engineering
GPA: 3.96/4.00
2020.09 - 2024.06 (Expected)
Beijing, China
💻 Internships
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Multimedia Laboratory, The Chinese University of Hong Kong
Research Assistant
2023.07 - 2023.09
Hong Kong S.A.R., China